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2005
Drop Impact Life Prediction Model for Lead-free BGA Packages and Modules, Luan, Jing-en; Tee, Tong Yan; Goh, Kim Yong; Ng, Hun Shen; Hussa, Esa; Reinikainen, Tommi; Kujala, Arni , EuroSimE Conference, Berlin, Germany, April 17-20, 2005., (2005) Abstract
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