Absolute and relative life prediction methodology for virtual qualification and design enhancement, Reinikainen, Tommi; Arni Kujala; Esa Hussa (STMicroelectronics) , (2005)

Application of Abagus/Explicit Submodeling Technique in Drop Simulation of System Assem, Reinikainen, Tommi; Wei Ren; Jianjun Wang , (2005)

A Novel Response Surface Method for Simulation-Based Design Optimizations of Electronic, Reinikainen, Tommi; B. Wang; Z. Han; L. Xu , (2005)

A Novel Response Surface Method for Simulation-Based Design Optimizations of Electronic Packages, Wang, Bo; Han, Zhen; Xu, Leon; Reinikainen, Tommi , EuroSimE 2005 conference, Berlin, Germany, 19.4.2005, (2005) Abstract

Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints, Reinikainen, Tommi , EuroSimE 2005 conference, Berlin 18.4.2005, (2005) Abstract

Design for Drop Impact Reliability of Lead-free BGA Pacjages with Life Prediction, Reinikainen, Tommi; Arni Kujala; Esa Hussa (STMicroelectronics) , (2005)

Drop Impact Life Prediction Model for Lead-free BGA Packages and Modules, Reinikainen, Tommi; Arni Kujala; Esa Hussa (STMicroeletronics) , (2005)

Deformation Characteristics and Microstructural Evolution of SnAgCu Solder Joints, Reinikainen, Tommi; P Marjamäki; J.K. Kivilahti , (2005)

Drop Impact Life Prediction Model for Lead-free BGA Packages and Modules, Luan, Jing-en; Tee, Tong Yan; Goh, Kim Yong; Ng, Hun Shen; Hussa, Esa; Reinikainen, Tommi; Kujala, Arni , EuroSimE Conference, Berlin, Germany, April 17-20, 2005., (2005) Abstract

Fatigue Life Prediction Models for Lead-free BGA Packages and Modules, Reinikainen, Tommi , (2005)

FINITE ELEMENT MODELLING OF A BGA PACKAGE SUBJECTED TO THERMAL AND, Myllykoski, Pirkka; Reinikainen, Tommi; Rodgers, Bryan; Punch, Jeff; Jarvis, John , 2002 IEEE. Reprinted from the 2002 Proceedings of the ITherm Conference on Thermal, Mechanics and Thermomechanical Phenomena in Electronic Systems., (2002) Abstract

Finite Element Modelling of a BGA Package Subjected to Thermal and Power Cycling, Myllykoski, Pirkka; Reinikainen, Tommi; Rodgers, Bryan; Punch, Jeff; Jarvis, John , (2002) Abstract

Microvia fatigue life prediction under thermo-mechanical cyclic loading condition, Wang, Jianjun; Jiansen Zhu; Stephen Quander; Tommi Reinikainen , (2002)

Deformation behavior of dilute SnBi(0.5 to 6 At. Pct) solid solutions, Reinikainen, T.; J. Kivilahti , (1999)

Evaluation of TBGA interconnection reliability, Pennanen, Virpi; Markku Tammenmaa; Tommi Reinikainen; Zhu Jiansen; Lin Wei , (1999)

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies, Reinikainen, Tommi; J. H. Okura; S. Shetty; B. Ramakrsihnan; et al. , (1999)

TBGA reliability in telecom environment, Pennanen, Virpi; Markku Tammenmaa; Tommi Reinikainen; Zhu Jiansen; Lin Wei , (1999)

A finite-element and experimental analysis of stress distribution of in various shear tests of solder joints, Reinikainen, Tommi; M. Poech; M. Krumm; J. Kivilahti , (1998)

Juoteliitosten luotettavuuden mallintaminen, Reinikainen, Tommi , (1998)

Mechanical and Microstructural Characteristics of Dilute SnBi and SnBiIn Alloys, Reinikainen, Tommi; J. K. Kivilahti , (1998)

Tools for assessing manufacturability and reliability of electronics assemblies utilising area array technologies, Savolainen, Petri; Tommi Reinikainen , (1998)