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2003
Interconnection reliability studies of some ceramic components and the introduction of the results into MTBF calculations, Andersson, Klas; Olli Salmela; Jussi Särkkä; Markku Tammenmaa , (2003)
Interconnection reliability of some lead-free RF-components in leadless packages, Andersson, Klas; Jussi Särkkä; Olli Salmela; Markku Tammenmaa , (2003)
Liitosluotettavuuden hallinta tuote- ja järjestelmätasolla, Tammenmaa, Markku; Olli Salmela; Jussi Särkkä; Klas Andersson , (2003)
Reliability of some ceramic components and the related effect on system performance, Andersson, Klas; Olli Salmela; Jussi Särkkä; Markku Tammenmaa , (2003)
The effect of material and dimension related parameters on the FIT-figures of interconnections in reliability calculations, Andersson, Klas; Olli Salmela; Jussi Särkkä; Markku Tammenmaa , (2003)
1999
Evaluation of TBGA interconnection reliability, Pennanen, Virpi; Markku Tammenmaa; Tommi Reinikainen; Zhu Jiansen; Lin Wei , (1999)
TBGA reliability in telecom environment, Pennanen, Virpi; Markku Tammenmaa; Tommi Reinikainen; Zhu Jiansen; Lin Wei , (1999)
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